4 天之前 · eeNews Europe-electronics products, power, boards, analog, automotive, embedded

2024年10月12日 · SOM builds on cross-point memory architectures, where memory are made from arrays of stacked electrodes crossing over one another. Phase-change memory and …

2024年11月5日 · The consortium is in the final phase of the procurement process leading to contract signature expected by the end of the year. The contract is estimated to be between …

2024年11月20日 · The Open Innovation Platform (OIP) meeting in the Netherlands this week showed that the 2nm process will be in production in 2025 following early tapeouts this year, …

2024年11月12日 · The SPINUS project is developing quantum simulators with more than 50 qubits and quantum computers with over ten qubits, the team expects that their research will …

2024年12月31日 · Wingtech, one of the leading contract manufacturers in China, has signed a deal to transfer the equity and operating assets of the majority of its manufacturing …

2016年6月29日 · 3. Basic assumptions for a Class‐E amplifier. Generally the analysis of the circuit is done with the ideal simplified assumptions: The transistor is an ideal switch, i.e. a short …

2024年11月12日 · The pick, pack and ship process is fully automated and orders are ready to ship within 15 minutes or less to enable the delivery times. “Our new product distribution …

2024年10月29日 · Infineon has cut the thickness of its silicon power wafer in half to 20µm, reducing the RDSon by 40% and the overall power losses by 15%.

2024年5月2日 · The fab will be located close to Silex’ existing 200mm wafer fab at its headquarters in Järfälla, Sweden. The fab will be set up to enable the wafer-level integration of …