IEEE17 小时
Soumya Batra
Soumya Batra, co-author of Llama 3 and Llama 2, has 11 years of experience in Natural Language Processing. Her journey spans ...
IEEE1 天
Steven H. Gold
Dr. Steven H. Gold received his Ph.D. in physics from the University of Maryland in 1978, and joined the Naval Research ...
IEEE3 天
Exploration Methodology For Bti-Induced Failures On Rram-Based Edge Ai Systems
While resistive switching memory technologies (RRAM) are seen by most of the scientific community as an enabler for Edge-level applications such as embedded deep Learning, AI or signal processing of ...
IEEE4 天
Advanced 3D Imaging Technologies for 3D IC Packages
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Non-Contact Measurement of Thermal Contact Resistance Using Lock-in Thermography
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Metrology for Hybrid Bonds, Microbumps and TSVs in Advanced Packaging – Are X-ray Methods ...
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Metrology Solutions for Hybrid Bond Processes: How to Push the Limits?
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
YAP: A Yield Model for Advanced Packaging
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Onshoring Advanced Packaging in the United States
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Enabling Advanced Chiplet-Based Design
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
How Did the “Hybrid Bonding” Technology Become Reliable?
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...
IEEE4 天
Advances in W2W Hybrid and Fusion Bonding to Enable Device Inflections in Logic and Memory
IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...