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Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Engineers from Eindhoven University of Technology are claiming to have set a new benchmark for the performance of InP ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

The center is designed to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...