Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

根据AI大模型测算文一科技后市走势。短期趋势看，该股当前无连续增减仓现象，主力趋势不明显。主力没有控盘。中期趋势方面，下方累积一定获利筹码。近期该股获筹码青睐，且集中度渐增。舆情分析来看，目前市场情绪极度悲观。

2月5日，文一科技（维权）涨1.35%，成交额2.56亿元，换手率5.12%，总市值50.02亿元。 根据AI大模型测算文一科技后市走势。短期趋势看，该股当前无连续增减仓现象，主力趋势不明显。主力没有控盘。中期趋势方面，上方有一定套牢筹码积压。近期该股获筹码青睐，且集中度渐增。舆情分析来看，目前市场情绪极度悲观。 1、公司在互动平台表示，公司正在研发的晶圆级封装设备属于先进封装专用工艺设备，可以用 ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

RRP will integrate Deca’s WLCSP and M-Series™ FOWLP technologies with the company’s assembly and testing processes. Deca, a leading technology development and licensing company in the ...

RRP will integrate Deca’s WLCSP and M-Series™ FOWLP technologies with the company’s assembly and testing processes. Deca, a leading technology development and licensing company in the advanced ...

RRP will integrate Deca’s WLCSP and M-Series FOWLP technologies with the company’s assembly and testing processes. Deca is a leading technology development and licensing company in the ...

This collaboration aims to strengthen India’s semiconductor manufacturing capabilities by integrating Deca's Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) ...