Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

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stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Engineers from Eindhoven University of Technology are claiming to have set a new benchmark for the performance of InP ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

The center is designed to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore ...