Hydrogen engines offer a fundamentally different approach to decarbonizing transport. IDTechExTechnology Analyst Mika Takahashi explains more about the technology in ...

In this short video, IDTechExTechnology Analyst James Kennedy discusses the impact of regulations on the adoption of bioplastics. For more see the IDTechEx market ...

Automotive plastics players, recycled plastics, automotive bioplastics, bio-composites, recycled carbon fiber, sustainable tires, upholstery materials, market analysis, 10-year granular forecasts, and ...

IDTechEx's latest report, "Hardware for HPC and AI 2025-2035: Technologies, Markets, Forecasts", provides data to show that the use of graphics processing units (GPUs) within high performance ...

After a Li-ion battery has served its first life in an electric vehicle (EV), automotive OEMs will be faced with deciding whether to send these batteries for recycling or for repurposing into ...

The healthcare sector is facing an array of issues. The global population is growing and aging, lifestyles are more sedentary, and chronic diseases are impacting millions worldwide. Existing ...

1.15. Challenges in the recycled plastics supply chain for automotive applications 1.16. Key tier 1 and OEM users of recycled plastic for automotive 1.17. Recycled plastic use remains limited in ...

In-mold electronics parts will have a market value of US$974 million in 2035. This webinar shares some of the research from the new IDTechEx report, "In-Mold Electronics 2025-2035: Forecasts, ...

IDTechEx Research provides timely market and technical research and strategic advice. Access individual reports or subscribeto receive the full benefit of all our expertise on the topics that matter ...

本报告涉及汽车领域可持续聚合物的新兴市场，涵盖了相关技术及市场参与者。报告详细阐述了实施状况，并对采用可持续材料所面临的挑战及未来展望进行了分析。重点探讨的领域包括再生塑料、生物塑料、复合材料，内部与外部组件、室内装饰、轮胎制造和 ...

此报告是 IDTechEx 过去十年来对可穿戴技术市场和技术研究的巅峰。它包含所有可穿戴设备领域的重大主题、产品趋势和驱动因素的精准概述和数据；以及各个领域的所有整理总结和市场数据，包括智能手表和健身追踪器、VR、AR 和 MR、耳戴式设备、智能服装和 ...

由IDTechEx发布的《2025年-2035年半导体先进封装》报告对持续发展的半导体封装领域进行了深刻剖析，尤其聚焦于2.5D与3D封装技术的最新进展。该报告不仅研究了当下的技术风向标、行业面临的挑战以及领军企业的突破性成就，还对未来的市场走向进行了预测。