IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to ...

"IEEE.tv is an excellent step by IEEE. This will pave a new way in knowledge-sharing and spreading ideas across the globe." ...

Xpedition™ Package Designer (xPD) 软件专为新兴高密度先进封装 (HDAP ... 准确识别 EM 电流密度违规情况，以及为 3D-IC 封装设计提供准确的提取和建模。 将 2.5D 3D IC 物理验证提升到更高水平 随着封装设计的发展，验证要求和挑战如影相随。设计人员在处理 2.5/3D IC 设计 ...

Abstract: This chapter focuses on single‐chip packages (SCPs), multi‐layered organic (MLO) substrates and integrated circuit (IC) fabrication and assembly for standard SCPs, and customized assemblies: ...

Abstract: This chapter focuses on single‐chip packages (SCPs), multi‐layered organic (MLO) substrates and integrated circuit (IC) fabrication and assembly for standard SCPs, and customized assemblies: ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

ITRI developed a heterogeneous integration of design technology as a complement of commercial EDA tool which can’t fully support 3D IC. These efforts include a high-level thermal analysis tool ...

will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...